Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
Wei Chen(Shanghai Jiao Tong University), Jiajie Fan(Shanghai University of Electric Power), Xi Zhu(Chinese University of Hong Kong, Shenzhen), Guoqi Zhang(Delft University of Technology), Xuejun Fan(Lamar University), Xu Liu(Harbin University of Science and Technology), Dong Hu(Delft University of Technology)
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