Adhesion, bonding and electronic properties of Ti/Zr doped c-BN(100)/Cu(100) interfaces: A first-principles study
Hongzhe Li(Suzhou University of Science and Technology), Mingxing Ma(Zhongyuan University of Technology), Qing Miao(Suzhou University of Science and Technology), Jinbin Lu(Suzhou University of Science and Technology), Zihan Deng(Huazhong Agricultural University)
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