Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock
Ming Wu(Nanchang Hangkong University), Jilin Xie(Nanchang Hangkong University), Timing Zhang(Nanchang Hangkong University), Peng Lu(Shandong University), Min Hong(Nanchang Hangkong University), Zongxiang Yao(Chongqing University of Science and Technology), Jiaming Ni(Nanchang Hangkong University), Wenjun Sun(Nanchang Hangkong University), Yuhua Chen(Nanchang Hangkong University), Shanlin Wang(Dalian University of Technology), Limeng Yin(Chongqing University of Science and Technology)
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