Micro-encapsulation of a low-melting-point alloy phase change material and its application in electronic thermal management
Shuo Wang(Dalian Institute of Chemical Physics), Deqiu Zou(Ningbo University), Yuanqiang Zhang(Ningbo University), Xiangyu Zhao, Hao Wang(University of Science and Technology Liaoning), Zhiyuan Wang(Shenyang Pharmaceutical University)
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