Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints
Qian Sun(Soochow University), Akira Kato(The University of Tokyo), Xingwen Zhou(Soochow University), Xiaonan Wang(Soochow University), Jie Wang(Fuzhou University), Xiaoxia Tang(Yancheng Institute of Technology)
Cited by 16
Related Papers
Recent Progress of Vacancy Engineering for Electrochemical Energy Conversion Related Applications
|Advanced Functional Materials|2020|362
Crystal phase-based epitaxial growth of hybrid noble metal nanostructures on 4H/fcc Au nanowires
|Nature Chemistry|2018|298
Effects of post-weld heat treatment on the microstructure and mechanical properties of laser-welded NiTi/304SS joint with Ni filler
|Materials Science and Engineering A|2019|274
Ultrafine Nickel Nanoparticles Encapsulated in N-Doped Carbon Promoting Hydrogen Oxidation Reaction in Alkaline Media
|ACS Catalysis|2021|99
Laser writing of Cu/Cu O integrated structure on flexible substrate for humidity sensing
|Applied Surface Science|2019|63