Toward Ultrahigh Thermoelectric Performance of Cu<sub>2</sub>SnS<sub>3</sub>‐Based Materials by Analog Alloying
Wang Li(Huazhong University of Science and Technology), Junyou Yang(Huazhong University of Science and Technology), Yingchao Wei(Huazhong University of Science and Technology), Zheng Ma(Huazhong University of Science and Technology), Xin Li(Shanghai University), Chengjun Li(North Carolina State University), Yang Tao(Huazhong University of Science and Technology), Yubo Luo(Northwestern University), Tian Xu(Huazhong University of Science and Technology), Yongxin Qian(Huazhong University of Science and Technology), Qinghui Jiang(Huazhong University of Science and Technology)
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