Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array

Yupu Ma(Institute of Electronics), Jian Peng(Xiamen University), Jiyu Qian(Institute of Electronics), Tao Wei(Guizhou Normal University)
Journal of Thermal Science and Engineering Applications
April 21, 2023
10.1115/1.4062400
Cited by 10

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