Simultaneously enhancing mechanical properties and electrical conductivity of Cu-0.5%Cr alloy as 5G connector material

Zhu Qi Chu(Changzhou University), Xiang Kui Liu(Changzhou University), Dan Wang(Tianjin University of Traditional Chinese Medicine), Wei Wei(Changzhou University), Xu Long An(Changzhou University), Kun Wei(Changzhou University), Igor Alexandrov(European Organization for Nuclear Research)
Journal of Alloys and Compounds
March 21, 2023
Cited by 26


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