A Hybrid Computing-In-Memory Architecture by Monolithic 3D Integration of BEOL CNT/IGZO-based CFET Logic and Analog RRAM

Ran An(Case Western Reserve University), Huaqiang Wu(Beijing Advanced Sciences and Innovation Center), Bin Gao(Chinese Academy of Sciences), Qingwen Li(University of Science and Technology Beijing), Yuankun Li(Tsinghua University), Zhengcao Li(State Key Laboratory of New Ceramics and Fine Processing), Yiwei Du(Sichuan University), Qingtian Zhang(Tsinghua University), Wen Sun(Tsinghua University), Song Qiu(Murdoch University), Jiaming Li(Tsinghua University), Yijun Li(Institute of Microelectronics), He Qian(University of Science and Technology of China), Qi Qin(Tsinghua University), Han Zhao(Tsinghua University), Jian Yao(Suzhou Institute of Nano-tech and Nano-bionics), Jianshi Tang(Tsinghua University)
2022 International Electron Devices Meeting (IEDM)
December 3, 2022
Cited by 50


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