High-fidelity and clean nanotransfer lithography using structure-embedded and electrostatic-adhesive carriers
Zhuofei Gan(University of Hong Kong), Wen‐Di Li(Institut de Recherche et d’Innovation), Xing Cheng(Southern University of Science and Technology), Shuhui Yu(Chinese Academy of Sciences), Siyi Min(Southern University of Science and Technology), Zeyu Liang(Zhejiang University), Yu Liu(Southern University of Science and Technology), Junyi Yu(Chinese Academy of Sciences), Liyang Chen(Hunan Normal University), Fei Han(Southern University of Science and Technology), Zhao Sun(University of Hong Kong), Chuying Sun(University of Hong Kong), Dehu Cui(Southern University of Science and Technology), Jingxuan Cai(Zhejiang University)
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