Thermoelectric Performance Enhancement in Commercial Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> Materials by Introducing Gradient Cu-Doped Grain Boundaries

Shuankui Li(Guangzhou University), Feng Pan(Peking University), Yajuan Cheng(Guangzhou University), Lei Chen(National University of Singapore), Wenguang Zhao(King University), Kai Guo(Guangzhou University), Mengxin Xu(Peking University)
ACS Applied Materials & Interfaces
December 22, 2022
Cited by 20


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