Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

Romina Sattari(Delft University of Technology), Guoqi Zhang(Delft University of Technology), Henk van Zeijl(Delft University of Technology), Dong Hu(Delft University of Technology), Sten Vollebregt(Delft University of Technology), Xu Liu(Harbin University of Science and Technology)
Applied Thermal Engineering
October 21, 2022
10.1016/j.applthermaleng.2022.119503
Cited by 25

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