Influences of Organic Acids in the Soldering Flux System on Wettability and Self-alignment Ability of Sn–3.0Ag–0.5Cu Solder Paste during Reflow Process

Huan He(Yuntianhua Group (China)), Xinping Zhang(Hunan Children's Hospital), Jun-Hu Qin(Yuntianhua Group (China)), Xin Wu(Beijing University of Posts and Telecommunications), Shu Fang(Peking University)
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
August 10, 2022
10.1109/icept56209.2022.9873445
Cited by 2

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