Transient Overgrowth of a Resistive Barrier Layer by Electrodeposited Metal in the Presence of Additives

Matthew Willis(University of Illinois Urbana-Champaign), Richard C. Alkire(University of Illinois Urbana-Champaign), Yan Qin(Shanghai Electric (China))
ECS Meeting Abstracts
March 1, 2007
Cited by 0


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