High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
Jiajie Fan(Shanghai University of Electric Power), Guoqi Zhang(Delft University of Technology), Dawei Jiang(Ministry of Education), Dong Hu(Delft University of Technology), Xuejun Fan(Lamar University), Xu Liu(Harbin University of Science and Technology), Hao Zhang(Jiangsu University of Science and Technology)
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