Microstructure evolution and mechanical properties of copper/304 stainless-steel joints by low-temperature soldering
Shuyi Yao(Southwest Jiaotong University), Hui Chen(Tianjin University), Xin Shi(Institute of Quality Standards and Testing Technology for Agro Products), Yao Wang(Southwest Jiaotong University), Yuanxing Li(Guangdong University of Technology), Xiangbo Zheng(Huazhong Agricultural University), Liping Wan
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