An organic dielectric filler polyethylene glycol-polyaniline block copolymer with low-density used in PVDF-based composites

Danian Liu(Nanjing University of Aeronautics and Astronautics), Hua Ren(Hankou University), Wenhai Peng(Wenzhou University), Houqing Wang(Nanjing University of Aeronautics and Astronautics), Jingwen Wang(Nanjing University of Aeronautics and Astronautics)
Composites Science and Technology
January 31, 2022
10.1016/j.compscitech.2022.109300
Cited by 7

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