High-temperature tensile behaviors and microstructural evolutions of a directionally solidified Ti–45Al–5Nb–2Mn alloy
Hailing Wang(State Key Laboratory on Integrated Optoelectronics), Liangcai Zeng(Wuhan University of Science and Technology), Ruirun Chen(Harbin Institute of Technology), Hongsheng Ding(Harbin Institute of Technology), Qiang Wang(North University of China)
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