Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

Xu Liu(Harbin University of Science and Technology), Guoqi Zhang(Delft University of Technology), X ZHAO, Quan Zhou(Beijing University of Technology), Huaiyu Ye(Chongqing University), Sau Koh(Huawei Technologies (China))
Unknown
June 1, 2021
10.1109/ectc32696.2021.00304
Cited by 11

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