Covalent SO Bonding Enables Enhanced Photoelectrochemical Performance of Cu<sub>2</sub>S/Fe<sub>2</sub>O<sub>3</sub> Heterojunction for Water Splitting
Yan Zhang(Shandong University), Artur Braun(Swiss Federal Laboratories for Materials Science and Technology), Shi‐Shi Zhu(Shandong University), Yuanyuan Liu(Shandong University), Xing Zhang(Chinese Academy of Sciences), Yuan Huang(Shandong University), Jianjun Wang(Shandong University)
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