Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures

Changlin Liu(Huazhong University of Science and Technology), Xiao Chen(Huazhong University of Science and Technology), Jinyang Ke(Huazhong University of Science and Technology), Zhongdi She, Jianguo Zhang(Huazhong University of Science and Technology), Junfeng Xiao(Huazhong University of Science and Technology), Jianfeng Xu(Huazhong University of Science and Technology)
Journal of Manufacturing Processes
June 26, 2021
Cited by 78

Abstract


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