Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics

Brun, Frassati, Vicard, Lépine(Centre National de la Recherche Scientifique), Mourey
European Microelectronics and Packaging Conference
January 1, 2009
Cited by 15

Related Papers

The increasing burden of depression
|Neuropsychiatric Disease and Treatment|2011|1.2k
L'épidémiologie des troubles anxieux et dépressifs dans une population générale française.
|Unknown|1994|13
A high efficient LDMOS power amplifier based on an inverse class F architecture
|European Microwave Conference|2004|5
THE SOLAR WIND ON 1 NOVEMBER 1984: OBSERVATIONS BY THE AMPTE-UKS SPACECRAFT
|OpenGrey (Institut de l'Information Scientifique et Technique)|1988|3
On Diabetogenic Leucomaines
|The American Journal of the Medical Sciences|1902|0