3D Lamellar-Structured Graphene Aerogels for Thermal Interface Composites with High Through-Plane Thermal Conductivity and Fracture Toughness

Pengfei Liu(Beijing University of Chemical Technology), Xiaofeng Li(Beijing University of Chemical Technology), Peng Min(Beijing University of Chemical Technology), Xiyuan Chang(Beijing University of Chemical Technology), Chao Shu(Beijing University of Chemical Technology), Yun Ding(Beijing University of Chemical Technology), Zhong‐Zhen Yu(Beijing Advanced Sciences and Innovation Center)
Nano-Micro Letters
November 11, 2020
Cited by 270Open Access
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Abstract

Although thermally conductive graphene sheets are efficient in enhancing in-plane thermal conductivities of polymers, the resulting nanocomposites usually exhibit low through-plane thermal conductivities, limiting their application as thermal interface materials. Herein, lamellar-structured polyamic acid salt/graphene oxide (PAAS/GO) hybrid aerogels are constructed by bidirectional freezing of PAAS/GO suspension followed by lyophilization. Subsequently, PAAS monomers are polymerized to polyimide (PI), while GO is converted to thermally reduced graphene oxide (RGO) during thermal annealing at 300 °C. Final graphitization at 2800 °C converts PI to graphitized carbon with the inductive effect of RGO, and simultaneously, RGO is thermally reduced and healed to high-quality graphene. Consequently, lamellar-structured graphene aerogels with superior through-plane thermal conduction capacity are fabricated for the first time, and its superior through-plane thermal conduction capacity results from its vertically aligned and closely stacked high-quality graphene lamellae. After vacuum-assisted impregnation with epoxy, the resultant epoxy composite with 2.30 vol% of graphene exhibits an outstanding through-plane thermal conductivity of as high as 20.0 W m−1 K−1, 100 times of that of epoxy, with a record-high specific thermal conductivity enhancement of 4310%. Furthermore, the lamellar-structured graphene aerogel endows epoxy with a high fracture toughness, ~ 1.71 times of that of epoxy.


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