22‐2: An Ultra‐thin Flexible Thin Film Encapsulation Structure with High Transmittance and Reliability
Youwei Wang(Tianjin University), Ruijiang Hong(Kunming University of Science and Technology), Chengjie Qin(BOE Technology Group (China)), Tao Wang(BOE Technology Group (China)), Ziyu Zhang(Fudan University), Song Zhang(Stanford University), Tao Sun(BOE Technology Group (China))
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