Improved Confinement of C-2 Field-Reversed Configuration Plasmas

H. Gota(TAE Technologies, Inc (United States)), A. D. Van Drie(TAE Technologies, Inc (United States)), M. Onofri(Aristotle University of Thessaloniki), A. Sibley(TAE Technologies, Inc (United States)), N. Rath(TAE Technologies, Inc (United States)), Michl Binderbauer(TAE Technologies, Inc (United States)), P. Feng(TAE Technologies, Inc (United States)), J. H. Schroeder(TAE Technologies, Inc (United States)), F. Ceccherini(TAE Technologies, Inc (United States)), John Kinley(TAE Technologies, Inc (United States)), D. Gupta(TAE Technologies, Inc (United States)), L. C. Steinhauer(TAE Technologies, Inc (United States)), B. H. Deng(University of California, Los Angeles), S. Primavera(TAE Technologies, Inc (United States)), S. Gupta(TAE Technologies, Inc (United States)), K. D. Conroy(TAE Technologies, Inc (United States)), R. Mendoza(TAE Technologies, Inc (United States)), K. Knapp(TAE Technologies, Inc (United States)), María Luisa Cordero(TAE Technologies, Inc (United States)), E. Trask(Los Alamos National Laboratory), L. Schmitz(University of California, Los Angeles), S. Aefsky(Brandeis University), D. Q. Bui(TAE Technologies, Inc (United States)), D. Osin(Tokamak Energy (United Kingdom)), T.E. Valentine(TAE Technologies, Inc (United States)), M. Tuszewski(Los Alamos National Laboratory), E. Granstedt(TAE Technologies, Inc (United States)), N. Rostoker(TAE Technologies, Inc (United States)), S. Korepanov(TAE Technologies, Inc (United States)), J. Roméro(TAE Technologies, Inc (United States)), Y. Mok(TAE Technologies, Inc (United States)), L. Sevier(TAE Technologies, Inc (United States)), A. Longman(TAE Technologies, Inc (United States)), Richard Magee, I. Allfrey, J. D. Douglass(Sandia National Laboratories), S. Putvinski(TAE Technologies, Inc (United States)), T. Roche(TAE Technologies, Inc (United States)), Y. Song(TAE Technologies, Inc (United States)), R. Clary(TAE Technologies, Inc (United States)), A. Nečas(TAE Technologies, Inc (United States)), Heng Guo(Shihezi University), D. C. Barnes(TAE Technologies, Inc (United States)), M. C. Thompson(TAE Technologies, Inc (United States)), T. Tajima(Shibaura Institute of Technology), C. F. Hooper(TAE Technologies, Inc (United States)), A. Smirnov(TAE Technologies, Inc (United States)), N. Bolte(TAE Technologies, Inc (United States)), E. Garate(TAE Technologies, Inc (United States)), Sean Dettrick(TAE Technologies, Inc (United States))
Fusion Science & Technology
May 21, 2015
10.13182/fst14-871
Cited by 7

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