Tool thermal deformation measurement research based on image processing technology
Kuo Wang(Changchun University), Jun Liu(Changchun University), Shihang Yao(Changchun University), Qiyin Lv(Harbin University of Science and Technology), Changlong Zhao(Jilin University), Xuxu Wang(Changchun University)
2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)
May 1, 2020
Cited by 2
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