Tool thermal deformation measurement research based on image processing technology

Kuo Wang(Changchun University), Jun Liu(Changchun University), Shihang Yao(Changchun University), Qiyin Lv(Changchun University), Changlong Zhao(Jilin University), Xuxu Wang(Changchun University)
2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)
May 1, 2020
Cited by 2


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