Enhanced terahertz imaging of electronic packaging materials with deconvolution algorithm
Chan Zheng(Guangdong University of Technology), Jinyun Zhou(Guangdong University of Technology), Dongshan Wei, Jingbo Liu(Xi'an University of Architecture and Technology), Dongxiong Ling(Dongguan University of Technology), Zheyu Song(Sun Yat-sen University), Shihan Yan(Wuhan University)
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