Multiplexed Assembly of Plasmonic Nanostructures Through Charge Inversion on Substrate for Surface Encoding

Yawen Wang(Southwest Jiaotong University), Lin Jiang(Fudan University), Liubiao Zhong, Wei Qin(University of Science and Technology of China), Dong Li(Soochow University), Wei Guo(China University of Geosciences), Zhiqiang Liang(Soochow University), Yinghui Sun(Soochow University), Wenkai Liang(Soochow University)
ACS Applied Materials & Interfaces
January 13, 2020
10.1021/acsami.9b17530
Cited by 17

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