Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs

Ravinder Dahiya(San Francisco VA Medical Center), Henrik Jörntell(Lund University), Libu Manjakkal(Edinburgh Napier University), Nivasan Yogeswaran(University of Glasgow), Fengyuan Liu(University of Glasgow), Etienne Burdet(Imperial College London), Vincent Hayward(Sorbonne Université)
Proceedings of the IEEE
October 1, 2019
Cited by 296


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