A survey of optimization techniques for thermal-aware 3D processors

Kun Cao(Shanghai Key Laboratory of Trustworthy Computing), Keqin Li(Hunan University of Science and Technology), Mingsong Chen(Central South University), Shiyan Hu(Chinese University of Hong Kong), Tongquan Wei(East China Normal University), Junlong Zhou(Nanjing University of Science and Technology)
Journal of Systems Architecture
January 8, 2019
Cited by 106


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