Solution for the Drift Problem of the Chip in the Packaging Process

Shaohua Dong(Applied Photonics (United Kingdom)), Junmin Wu(State Grid Corporation of China (China)), Rui Jin(Imperial College London), Feng He(Southern University of Science and Technology), Yue‐Yang Liu(Institute of Semiconductors), Jiang Liu(State Grid Corporation of China (China)), Yan Pan(State Grid Corporation of China (China)), Guoqing Leng(State Grid Corporation of China (China))
MATEC Web of Conferences
January 1, 2018
10.1051/matecconf/201823204044
Cited by 0

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