Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics
Shanshan Xu(University of Colorado Boulder), Luu Nguyen(Vietnam Atomic Energy Instiute), Rongfu Wen(Dalian University), Ronggui Yang(Huazhong University of Science and Technology), Yung-Cheng Lee(University of Colorado Boulder), Woochan Kim(Texas Instruments (United States)), Ryan Lewis(University of Colorado Boulder)
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