300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB
Kyoya Takano(Hiroshima University), Minoru Fujishima(Hiroshima University), Shuhei Amakawa(Hiroshima University), Shinsuke Hara(National Institute on Consumer Education), Akifumi Kasamatsu(National Institute of Information and Communications Technology), Takeshi Yoshida(Hiroshima University), Kazunori Mizuno(Panasonic (Japan)), Kosuke Katayama(Hiroshima University), Ruibing Dong(National Institute of Information and Communications Technology), Koichi Takahashi(Panasonic (Japan))
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