Robust memristors based on layered two-dimensional materials

Miao Wang; Songhua Cai; Chen Pan; Chenyu Wang; Xiaojuan Lian; Ye Zhuo; Kang Xu; Tianjun Cao; Xiaoqing Pan; Baigeng Wang; Shi‐Jun Liang; J. Joshua Yang; Peng Wang; Feng Miao

doi:10.1038/s41928-018-0021-4

Robust memristors based on layered two-dimensional materials

Miao Wang(Collaborative Innovation Center of Advanced Microstructures), Songhua Cai(Collaborative Innovation Center of Advanced Microstructures), Chen Pan(Collaborative Innovation Center of Advanced Microstructures), Chenyu Wang(Collaborative Innovation Center of Advanced Microstructures), Xiaojuan Lian(Collaborative Innovation Center of Advanced Microstructures), Ye Zhuo(University of Massachusetts Amherst), Kang Xu(Collaborative Innovation Center of Advanced Microstructures), Tianjun Cao(Collaborative Innovation Center of Advanced Microstructures), Xiaoqing Pan(University of California, Irvine), Baigeng Wang(Collaborative Innovation Center of Advanced Microstructures), Shi‐Jun Liang(Collaborative Innovation Center of Advanced Microstructures), J. Joshua Yang(University of Massachusetts Amherst), Peng Wang(Collaborative Innovation Center of Advanced Microstructures), Feng Miao(Collaborative Innovation Center of Advanced Microstructures)

Nature Electronics

February 2, 2018

10.1038/s41928-018-0021-4

Cited by 777Open Access

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