The state of residual stresses in the Cu/Steel bonded laminates after ISF deformation: An experimental analysis
Xiaofan Shi(Shanghai University of Engineering Science), Yan Liu(Hebei Medical University), Ghulam Hussain(Ghulam Ishaq Khan Institute of Engineering Sciences and Technology), Dacheng Huang(Shanghai University of Engineering Science), Fang Song(Shanghai University of Engineering Science), Shahid Ikramullah Butt
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