PCB Reverse Engineering Using Nondestructive X-ray Tomography and Advanced Image Processing
Navid Asadizanjani(University of Connecticut), Domenic Forte(University of Connecticut), Mark Tehranipoor(University of Connecticut)
IEEE Transactions on Components Packaging and Manufacturing Technology
January 1, 2017
Cited by 69
Related Papers
A Survey on Chip to System Reverse Engineering
|ACM Journal on Emerging Technologies in Computing Systems|2016|249
Quality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging
|Optics and Lasers in Engineering|2017|205
The Big Hack Explained
|ACM Journal on Emerging Technologies in Computing Systems|2020|99
Hardware Trust and Assurance through Reverse Engineering: A Tutorial and Outlook from Image Analysis and Machine Learning Perspectives
|ACM Journal on Emerging Technologies in Computing Systems|2021|87
Trojan Scanner: Detecting Hardware Trojans with Rapid SEM Imaging Combined with Image Processing and Machine Learning
|Proceedings - International Symposium for Testing and Failure Analysis|2018|73