Thermosonic flip-chip bonding system with a self-planarization feature using polymer
Qing Tan(University of Colorado Boulder), Yung-Cheng Lee(University of Colorado Boulder), Braydon Schaible(University of Colorado Boulder), Leonard J. Bond(University of Colorado Boulder)
Cited by 33
Related Papers
Three-Dimensional Superhydrophobic Nanowire Networks for Enhancing Condensation Heat Transfer
|Joule|2017|279
Liquid-Vapor Phase-Change Heat Transfer on Functionalized Nanowired Surfaces and Beyond
|Joule|2018|274
Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays
|Nano Energy|2017|262
Three-Dimensional Ni/TiO<sub>2</sub> Nanowire Network for High Areal Capacity Lithium Ion Microbattery Applications
|Nano Letters|2011|233
Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures
|Nano Energy|2018|215