Retention-Aware Hybrid Main Memory (RAHMM): Big DRAM and Little SCM
Weiliang Jing(Fudan University), Bomy Chen(Microchip Technology (Germany)), Beomseop Lee(Samsung (South Korea)), Yinyin Lin(Fudan University), Yong Ye(Anhui University), Sangkyu Yoon(Samsung (South Korea)), Yuan Du, Kai Yang(Fudan University)
Cited by 9
Related Papers
A Review on Applications of Capacitive Displacement Sensing for Capacitive Proximity Sensor
|IEEE Access|2020|221
High-performance flexible strain sensors based on biaxially stretched conductive polymer composites with carbon nanotubes immobilized on reduced graphene oxide
|Composites Part A Applied Science and Manufacturing|2021|132
Chemical-potential multiphase lattice Boltzmann method with superlarge density ratios
|Physical review. E|2020|62
Square concrete-filled stainless steel/carbon steel bimetallic tubular stub columns under axial compression
|Journal of Constructional Steel Research|2018|53
Upcycling Spent Cathode Materials to Bifunctional Catalysts for High‐Stability Lithium–Sulfur Batteries
|Advanced Functional Materials|2024|50