Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging
Ping Zhang(Guilin University of Electronic Technology), Daoguo Yang(Guilin University of Electronic Technology), Miao Cai(Guilin University of Electronic Technology), Rongzhuan Wei(Guilin University of Electronic Technology), Jianhua Zeng(Shangrao Normal University), Jing Xiao(Guilin University of Electronic Technology)
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