Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure

Shanshan Xu(University of Colorado Boulder), Ronggui Yang(Huazhong University of Science and Technology), Li‐Anne Liew(University of Colorado Boulder), Yung-Cheng Lee(University of Colorado Boulder), Ryan J. Lewis(University of Colorado Boulder)
Journal of Microelectromechanical Systems
August 5, 2016
Cited by 56


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