Thin Flexible Thermal Ground Planes: Fabrication and Scaling Characterization

Ryan Lewis(University of Colorado Boulder), Yung-Cheng Lee(University of Colorado Boulder), Ronggui Yang(Huazhong University of Science and Technology), Collin Coolidge(University of Colorado Boulder), Li‐Anne Liew(University of Colorado Boulder), Shanshan Xu(University of Colorado Boulder)
Journal of Microelectromechanical Systems
September 25, 2015
Cited by 78


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