Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
Qing Tan(University of Colorado Boulder), Yung-Cheng Lee(University of Colorado Boulder), Wenge Zhang(University of Colorado Boulder), Braydon Schaible(University of Colorado Boulder), Leonard J. Bond(University of Colorado Boulder), Teh-Hua Ju(University of Colorado Boulder)
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
January 1, 1998
Cited by 56
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