Polymer tapered waveguides and flip-chip solder bonding as compatible technologies for efficient OEIC coupling
Dominic Goodwill(University of Colorado Boulder), Darja Tomić(University of Colorado Boulder), R.S. Fan(University of Colorado Boulder), Alan R. Mickelson(University of Colorado Boulder), Yung-Cheng Lee(University of Colorado Boulder), R. Brian Hooker(University of Colorado Boulder), B.L. McComas(University of Colorado Boulder), Nina D. Morozova(University of Colorado Boulder)
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