A 3-D Integrated Intrachip Free-Space Optical Interconnect for Many-Core Chips
Berkehan Çiftçioğlu(University of Rochester), Hui Wu(Jiangsu University), Jianyun Hu(University of Rochester), Eby G. Friedman(University of Rochester), G. W. Wicks(University of Rochester), Ioannis Savidis(University of Rochester), Zach Darling(University of Rochester), Jing Xue(University of Rochester), Michael Huang(University of Rochester), Shang Wang(University of Rochester), Jian Zhang(Chinese Academy of Sciences), Alok Garg(National Institute of Technology Hamirpur), Manish Jain(University of Rochester), Rebecca Berman(University of Rochester), Duncan T. Moore(University of Rochester)
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