256-Mb DRAM circuit technologies for file applications

G. Kitsukawa(Hitachi (Japan)), Masashi Horiguchi(Hitachi (Japan)), Y. Kawajiri(Hitachi (Japan)), T. Kawahara(Hitachi (Japan)), T. Akiba(Hitachi (Japan)), Y. Kawase(Hitachi (United Kingdom)), T. Tachibana(Hitachi (United Kingdom)), Takeshi Sakai(Hitachi (Japan)), Masakazu Aoki(Hitachi (Japan)), S. Shukuri(Hitachi (Japan)), K. Sagara(Hitachi (Japan)), R. Nagai(Hitachi (United Kingdom)), Yuzuru Ohji(Hitachi (United Kingdom)), Norio Hasegawa(Hitachi (United Kingdom)), N. Yokoyama(Hitachi (Japan)), T. Kisu(Hitachi (United Kingdom)), Hiroyuki Yamashita(Hitachi (Japan)), T. Kure(Hitachi (Japan)), Takashi Nishida(Hitachi (United Kingdom))
IEEE Journal of Solid-State Circuits
November 1, 1993
Cited by 39

Abstract

256-Mb DRAM circuit technologies characterized by low power and high fabrication yield for file applications are described. The newly proposed and developed circuits are a self-reverse-biasing circuit for word drivers and decoders to suppress the subthreshold current to 3% of the conventional scheme, and a subarray-replacement redundancy technique that doubles chip yield and consequently reduces manufacturing costs. An experimental 256-Mb DRAM has been designed and fabricated by combining the proposed circuit techniques and a 0.25- mu m phase-shift optical lithography, and its basic operations are verified. A 0.72- mu m/sup 2/ double-cylindrical recessed stacked-capacitor (RSTC) cell is used to ensure a storage capacitance of 25 fF/cell. A typical access time under a 2-V power supply voltage was 70 ns. With the proper device characteristics, the simulated performances of the 256-Mb DRAM operating with a 1.5-V power supply voltage are a data-retention current of 53 mu A and an access time of 48 ns.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>


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