Thermosonic bonding of an optical transceiver based on an 8×8 vertical cavity surface emitting laser array

T. McLaren(University of Colorado Boulder), Yung-Cheng Lee(University of Colorado Boulder), Wenge Zhang(University of Colorado Boulder), Teh-Hua Ju(University of Colorado Boulder), Sa Yoon Kang(Samsung (South Korea))
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
May 1, 1997
Cited by 48


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