Challenges of Ultra low-k integration in BEOL interconnect for 45nm and beyond
H. Liu, L.C. Hsia, Chun Hui Low, San Leong Liew, W. P. Liu(Central China Normal University), Z. H. Wang, C. S. Seet, Bin Lin(University of Electronic Science and Technology of China), Wei Lü(Dalian University of Technology), Liyao Wu, Meisheng Zhou, J. Widodo, Y. H. Wang
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