Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Lijun Jiang(Hebei Medical University), J. Gill(IBM (United States)), E. G. Colgan(IBM (United States)), Howard Smith(IBM (United States)), A. Deutsch(IBM (United States)), J. Wakil(IBM (United States)), Barry J. Rubin(IBM (United States)), Seshadri Kolluri(University of California, Santa Barbara), M. Scheuermann(IBM Research - Thomas J. Watson Research Center)
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