Effects of Cu Interdiffusion on the Electromigration Failure of FM/Cu/FM Tri-Layers for Spin Valve Read Sensors

Jing Jiang(University of Electronic Science and Technology of China), Sunwook Kim(National University of Singapore), Seongtae Bae(University of Minnesota)
IEEE Transactions on Magnetics
June 1, 2007
Cited by 2


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