Thermal Conductivity of the Diamond-Cu Composites with Chromium Addition
Qiang Zuo(Beijing Academy of Agricultural and Forestry Sciences), Ying Jiu Zhang(Zhengzhou University), Hai Jiang Fang(Applied Diamond (United States)), Wei Wang(Zhengzhou University), Peng Wang(Chang'an University), Li Ma(Zhengzhou University), Meng Sen Gu(Zhengzhou University), Jian Xin Li(Zhengzhou University), Xing Hu(Shanghai University)
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